The first monolithic 3D chip built in a U.S. foundry is breaking the 'memory wall' and 'miniaturization wall' that have slowed down AI hardware. By stacking ultra-thin layers like a high-rise, this chip moves data vertically at record speeds, promising order-of-magnitude performance boosts. Could this vertical leap redefine the future of AI hardware—and will it spark a new era of domestic chip innovation? #Tech #AIHardware #Semiconductors