Tag Page ChipPackaging

Can Dry Film Photoresist Outpace Liquid?

Asahi Kasei’s new Sunfort TA Series dry film photoresist is making waves in semiconductor packaging, promising ultra-fine wiring for AI servers and more. Dry film has always lagged behind liquid for high-res patterns, but this tech claims to close the gap for panel-level processing. Is this the moment dry film overtakes liquid in advanced chipmaking, or will old habits die hard? What’s your take on the future of photolithography? #Semiconductors #AI #ChipPackaging #Tech